MediaTek at the MWC 2018 unveiled Helio P60, the company’s latest processor for mid-range smartphones. This is the most powerful P series chipset from the Chinese chipset manufacturer, which is based on 12nm FinFET architecture. The company says that it is the first SoC platform with a multi-core AI processing unit (mobile APU) and MediaTek’s NeuroPilot AI technology.
The processor is manufactured by TSMC based on 12 nm FinFET technology. It features four ARM Cortex A73 2 GHz CPUs and four ARM Cortex A53 2 GHz CPUs in an Octa-Core big.LITTLE configuration. It says that the P60 is up to 12% more efficient overall and up to 25% more power efficient in highly demanding games compared to P23. It has MediaTek’s CorePilot 4.0 technology, with thermal management, user experience monitoring and Energy Aware Scheduling (EAS). Compared to the Helio P30 chipset, the Helio P60 offers up to 70% improved CPU performance.
The Mali-G72 MP3 is a flagship-class GPU, which is used in the chipsets like Kirin 970. The chipset offers a staggering 70% boost in overall GPU performance compared to its predecessor. In fact, the performance will be similar to Qualcomm Snapdragon 660 chipset.
The dedicated NeuroPilot can handle native AI tasks using Android Neural Networks API. The NeuroPilot AI technology works seamlessly across CPU, GPU and Mobile APU within the SoC to maximize performance and energy efficiency.
The MediaTek’s NeuroPilot SDK in P60 is compatible with Google Android Neural Networks API (Android NNAPI), and also supports common AI frameworks, including TensorFlow, TF Lite, Caffe, and Caffe2. The company is working on bringing ONNX support to the chipset in Q2 2018 to provide developers with even more flexibility for designing AI-powered applications.
It has three image signal processors (ISPs) that increase power efficiency by using 18% less power for dual-cameras set-ups. This will offer AI-infused experiences in apps with real-time beautification, novel, real-time overlays, AR/MR acceleration, enhancements to photography, real-time video previews and more.
The chipset supports 1080p displays with the aspect ratio up to 20:9. For memory, it can use UFS 2.1 storage and up to 8GB LPDDR4x RAM (1,800MHz). The onboard LTE modem supports Cat. 7 downlink speeds and Cat. 13 upload speeds and dual-SIM functionality.
The MediaTek Helio P60 will be available globally in early Q2.
MediaTek Helio P60 specifications
- CPU: Octa-core with four ARM Cortex-A73 up 2.0 GHz and four ARM Cortex-A53 up to 2.0GHz
- GPU: Arm Mali-G72 MP3 at 800MHz
- Memory: Up to 8GB, dual-channel LPDDR4x @ 1800 MHz
- Storage: eMMC 5.1 / UFS 2.1
- Camera: Up to 16+20MP or 32MP
- Display: Up to Full HD+ 20:9
- Connectivity: 802.11ac Wi-Fi, Bluetooth 4.2 and FM radio
- Cellular: Cat-7 (DL) / Cat-13 (UL); Dual 4G VoLTE; TAS 2.0; Global IMS
- Multi-GNSS: GPS/GLONASS/Beidou or GPS/GLONASS/Galileo co-receive
- MediaTek CorePilot 4.0: Energy Aware Scheduling, thermal management and UX monitoring
- Fabrication: TSMC 12nm