Snapdragon Tech Summit at day two of the conference, chip manufacturer Qualcomm provide all the details on their new flagship processor, the Snapdragon 855 which will be powered the 2019 flagship smartphone. This time the Snapdragon 855 uses TSMC’s latest 7nm FinFET manufacturing process and mainly focusing on connectivity, camera,
This year SoC manufacturer Qualcomm launched its flagship processor for a year i.e. Snapdragon 845 in Q1 2018. Which is found on most Android flagships including the Google Pixel 3 and OnePlus 6. This processor is made on 10 nm FinFET LPP Fabrication process. Whereas its competitors of flagship processor brands
At CES 2018 in January, the company announced that it was partnering with Xiaomi and Qualcomm to manufacture the Oculus Go VR Headset. Now Facebook is said to be planning on launching the Oculus Go VR Headset at F8 Developer Conference on May 1 according to sources of Variety. The company first introduced the Go VR Headset back in
OnePlus’ next flagship smartphone, the OnePlus 6, will be launching in Q2 2018. There is little information that we know about the device at this time. For starters, we’ve learned that it will feature the latest Qualcomm Snapdragon 845 system-on-chip. It’ll very likely launch with Android Oreo on board (meaning it supports Project Treble). Finally, there
Last week, Vivo officially announced the Vivo V9 India launch event to be held on March 27th in Mumbai. Today, the company preponed the launch event to March 23rd without mentioning any reason. Vivo's upcoming V9 has been leaking since last month, Now Vivo itself apparently wants in on the leaking game.
At the MWC 2018, Samsung and Sony unveiled their 2018 flagship smartphones powered by Qualcomm Snapdragon 845 Mobile Platform. In the coming months, we will be seeing flagship smartphones from other major manufacturers like HTC, LG, and Huawei. Now, we got to know the key specifications of the HTC’s upcoming flagship smartphone.
Qualcomm at its press conference at Mobile World Congress (2018) on Tuesday launched the Snapdragon 700 Mobile Platform series as its next range of system-on-chip (SoC) for affordable devices. The Snapdragon 700 series of chipsets from Qualcomm offers premium tier performance in the mid-tier smartphones. It also includes on-device AI support through the Qualcomm
Today at MWC 2018 in Barcelona Sony announced its latest flagship Android phones, the Xperia XZ2 and XZ2 Compact. Both new Sony phones are powered by Qualcomm’s Snapdragon 845 processor, the latest and greatest silicon that will be inside most of 2018’s Android flagships. They’re scheduled to ship this spring, with pricing
ASUS sent out invites for its Mobile World Congress (2018) event in Barcelona on February 27th. Press invites with the slogan “Back To 5”, coyly suggesting a new lineup of ZenFone 5 smartphones. But we know that ASUS has been selling smartphones under the ZenFone 5 umbrella brand since the Android Jelly Bean